Peer Review History: The Effect of Thermal Cycling Cycles on the Microstructure and Properties of Cu/In-48Sn-xGNSs/Cu Solder Joints

Editor(s):

(1) Dr. Bharatish A, RV College of Engineering, Bengaluru, India.

Reviewers:

(1) S. Suresh Kumar, PERI Institute of Technology, India.

(2) S. Kalaiselvi, Sona College of Technology, India.

Additional Reviewers:

(1) Mahlatse Mphahlele, Cape Peninsula University of Technology, South Africa.

(2) P. Selvaraj, PSN Institute of Technology and Science, India.

(3) Seonghoon Jeong, Republic of Korea,

(4) Vijayvignesh N S, Universiti Putra Malaysia, Malaysia.

Open Peer Review Policy: Click Here

Specific Comment:

Average Peer review marks at initial stage: 7.6/10

Average Peer review marks at publication stage: 9/10

Peer Review History:


Stage 1 | Original Manuscript | File 1 | NA


Stage 2 | Peer Review Report_1 (S. Suresh Kumar, India) | File 1 | NA


Stage 2 | Peer Review Report_2 (S. Kalaiselvi, India) | File 1 | NA


Stage 2 | Revised_MS_v1_and_Feedback_v1 | File 1 | File 2


Stage 3 | Comment_Editor_1_v1 | File 1 | NA


Posted in Review History.